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Assemblies

ATC // AVX assembly begins with high-precision pick-and-place of surface mount devices 0201 and larger including CSPs, μBGAs, flip-chips, ultra-fine-pitch [.012" (0.3 mm) lead pitch] QFPs and irregularly shaped components requiring ± .0005"
(± .0125 mm) placement accuracy

Die attach includes:

• Adhesive die attach – electrically / thermally conductive or electrically insulating epoxies
• Solder Die attach – lead or lead free for example, Sn63/Pb, 95Pb-5Sn, 80Au-20Sn, 88Pb, SAC305
• Wire/Ribbon Bonding – automated ball and wedge bonding, ribbon / wedge bonding and gold stud bumping

Encapsulation:

• Includes polymers, hermetic and non-hermetic structures and in-house fabricated ceramic enclosures.

Additional assembly processes:

• Screen and stencil printing
• Automated dispensing ( >7 mil diameter dots and lines)
• Parallel gap welding
• Solder tinning
• Via plugging (gold paste/epoxies)
• Solder mask application

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